首页> 外国专利> Light-mixing LED package structure for increasing color render index and brightness

Light-mixing LED package structure for increasing color render index and brightness

机译:混光LED封装结构可提高显色指数和亮度

摘要

A quasioptical LED package structure for increasing color render index and brightness includes a substrate unit, a light-emitting unit, a frame unit and a package unit. The light-emitting unit has a first light-emitting module for generating a first color temperature and a second light-emitting module for generating a second color temperature. The frame unit has two annular resin frames surroundingly formed on the top surface of the substrate unit by coating. The two annular resin frames respectively surround the first light-emitting module and the second light-emitting module in order to form two resin position limiting spaces above the substrate unit. The package unit has a first translucent package resin body and a second translucent package resin body both disposed on the substrate unit and respective covering the first light-emitting module and the second light-emitting module.
机译:用于提高显色指数和亮度的准光学LED封装结构包括基板单元,发光单元,框架单元和封装单元。发光单元具有用于产生第一色温的第一发光模块和用于产生第二色温的第二发光模块。框架单元具有通过涂覆而在基板单元的顶面上围绕地形成的两个环形树脂框架。两个环形树脂框架分别围绕第一发光模块和第二发光模块,以便在基板单元上方形成两个树脂位置限制空间。封装单元具有布置在基板单元上并分别覆盖第一发光模块和第二发光模块的第一半透明封装树脂体和第二半透明封装树脂体。

著录项

  • 公开/公告号EP2290279B1

    专利类型

  • 公开/公告日2016-01-13

    原文格式PDF

  • 申请/专利权人 PARAGON SC LIGHTING TECH CO;

    申请/专利号EP20100166011

  • 发明设计人 CHUNG CHIA-TIN;YANG SHEN-TA;WU FANG-KUEI;

    申请日2010-06-15

  • 分类号F21K99/00;H01L33/54;H01L25/075;

  • 国家 EP

  • 入库时间 2022-08-21 14:52:25

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号