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RECONSTITUTED WAFER PACKAGE WITH A DISCRETE HIGH VOLTAGE DICE AND INTEGRATED FIELD PLATE FOR HIGH TEMPERATURE LEAKAGE CURRENT STABILITY
RECONSTITUTED WAFER PACKAGE WITH A DISCRETE HIGH VOLTAGE DICE AND INTEGRATED FIELD PLATE FOR HIGH TEMPERATURE LEAKAGE CURRENT STABILITY
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机译:带离散高压骰子和集成场板的重组晶圆包装,可实现高温泄漏电流的稳定性
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摘要
A reconstituted wafer level package for a versatile high-voltage capable component is disclosed. The reconstituted wafer package includes a dice substantially encapsulated by a mold material except for a first face. A dielectric layer is disposed on the first face of the dice. The package further includes an array of ball bumps formed on an exterior facing portion of the dielectric layer. Further, a field plate is disposed within the dielectric material and interposed between the first face of the dice and the ball bump array. The field plate may be spaced from the dice by a predetermined distance to prevent dielectric breakdown of the material of the dielectric layer.
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