A metal line 731 is formed in a linear area S of an insulative substrate 720, and moreover a metal line 732 is formed generally parallel to the metal line 731 with a specified distance thereto. The metal line 731 is connected to an n-type semiconductor core 701 of bar-like structure light-emitting elements 710A to 710D, and the metal line 732 is connected to a p-type semiconductor layer 702. By dividing the insulative substrate 720 into a plurality of divisional substrates, a plurality of light-emitting devices in each of which a plurality of bar-like structure light-emitting elements 710 are placed on the divisional substrates are formed. Out of a plurality of light-emitting elements, bar-like structure light-emitting elements 710 that, even if cut off in a substrate dividing step, have no influence on a desired light emission quantity, are placed in cutting areas of the insulative substrate 720. Thus, even if bar-like structure light-emitting elements 710 that have been broken by cutting do not emit light, light emission is fulfilled by the other uncut plural bar-like structure light-emitting elements.
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