BRAZING FILLER METAL, BRAZING FILLER METAL PASTE, CERAMIC CIRCUIT SUBSTRATE, CERAMIC MASTER CIRCUIT SUBSTRATE, AND POWER SEMICONDUCTOR MODULE

摘要

To provide a brazing material for maintaining bonding strength between ceramic substrate and metal plate at a conventionally attainable level, while addition amount of In is reduced, and a brazing material paste using the same. A mixture powder provided by mixing alloy powder composed of Ag, In, and Cu, Agpowder, and active metal hydride powder, the mixture powder containing active metal hydride powder with a 10-to-25-µm equivalent circle average particle diameter by 0.5 to 5. 0 mass%, the equivalent circle average particle diameters for the alloy powder, Ag powder, and active metal hydride powder having a relationship: alloy powder ‰¥ active metal hydride powder Ag powder, and the powder mixture having a particle size distribution of d10 of 3 to 10 µm, d50 of 10 to 35 µm, and d90 of 30 to 50 µm, and in the frequency distribution, a peak of the distribution existing between d50 and d90.