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METHOD FOR JOINING NONPOLAR AND/OR LOW POLAR THERMOPLASTIC POLYMER

机译:结合非极性和/或低极性热塑聚合物的方法

摘要

PROBLEM TO BE SOLVED: To provide a joining method capable of joining a nonpolar and/or low polar thermoplastic polymer by thermal dielectric with micro waves and high-frequency waves not through a high polar thermoplastic polymer.;SOLUTION: A method for joining a nonpolar and/or low polar thermoplastic polymer includes: bonding a high polar liquid 6 which has a higher boiling point than that of the melting point of polymer bodies 4 and 5 to be bonded, to at least a portion to be joined to the other polymer body 5 (or another portion of polymer body) in one polymer body 4; bringing the one polymer body 4 and the other polymer body 5 (or another portion of polymer body) in contact with each other in the portion to be bonded; and then subjecting the liquid 6 to thermal dielectric thereby to thermally melt the portion to be bonded of the polymer bodies 4 and 5 through the liquid 6, and thereby joining the polymer bodies 4 and 5.;SELECTED DRAWING: Figure 2;COPYRIGHT: (C)2016,JPO&INPIT
机译:解决的问题:提供一种能够通过热电介质将微波和高频中的非极性和/或低极性热塑性聚合物通过高极性热塑性聚合物而不通过高极性热塑性聚合物进行连接的方法。和/或低极性热塑性聚合物包括:将高沸点高于要结合的聚合物体4和5的熔点的高极性液体6结合到至少一部分要结合到另一聚合物体上的部分。图5(或聚合物本体的另一部分)在一个聚合物本体4中;使一个聚合物主体4和另一聚合物主体5(或聚合物主体的另一部分)在要结合的部分中彼此接触;然后使液体6经受热介电作用,从而通过液体6热融化聚合物主体4和5的待粘合部分,从而将聚合物主体4和5接合起来。;图2;版权:( C)2016,日本特许厅

著录项

  • 公开/公告号JP2016150568A

    专利类型

  • 公开/公告日2016-08-22

    原文格式PDF

  • 申请/专利权人 POLYTEC DESIGN:KK;

    申请/专利号JP20150030697

  • 发明设计人 KURAMOCHI HIROSHI;

    申请日2015-02-19

  • 分类号B29C65/04;B29C67/04;

  • 国家 JP

  • 入库时间 2022-08-21 14:47:34

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