首页> 外国专利> MOUNTING STRUCTURE OF LED LIGHT EMISSION ELEMENT PACKAGE TO FOAMED RESIN METAL COATING COMPOSITE SHEET BOARD AND FOAMED RESIN METAL COATING COMPOSITE SHEET BOARD FOR LED LIGHTING EQUIPMENT

MOUNTING STRUCTURE OF LED LIGHT EMISSION ELEMENT PACKAGE TO FOAMED RESIN METAL COATING COMPOSITE SHEET BOARD AND FOAMED RESIN METAL COATING COMPOSITE SHEET BOARD FOR LED LIGHTING EQUIPMENT

机译:LED发光元件包装到发泡树脂金属涂层复合板的安装结构和发泡树脂金属涂层复合板用于LED照明设备的安装结构

摘要

PROBLEM TO BE SOLVED: To provide a foamed resin metal coating composite sheet board that has a high light reflection characteristic, is light in weight and can properly suppress temperature increase when LED illumination is used, and a mounting structure using the same.;SOLUTION: An insulating micro-foamed resin sheet has non-foamed layers on one surface and the other surface, and a micro-foamed layer between the two non-foamed layers. The surface of the non-foamed layer on the one surface is a light reflection plate, and the other surface is a non-foamed layer or micro-foamed layer. A foamed resin metal coating composite sheet board has a copper foil or copper alloy foil which is joined to the surface of the non-foamed layer or the micro-foamed layer on the other surface, and the copper foil or the copper alloy foil of the foamed resin metal coating composite sheet board is a wiring circuit for electric conduction. The foamed resin metal coating composite sheet board has an opening portion which is sized such that a case portion of an LED light emission element package can be inserted into the opening portion. A light emission face of the case portion of the LED light emission package is disposed in the opening portion of the board, and disposed substantially in parallel to at least a part of the other non-foamed layer of the board.;SELECTED DRAWING: Figure 1(a);COPYRIGHT: (C)2016,JPO&INPIT
机译:解决的问题:提供一种具有高的光反射特性,重量轻并且可以在使用LED照明时适当地抑制温度升高的泡沫树脂金属涂层复合板及其安装结构。绝缘微发泡树脂片材在一个表面和另一个表面上具有非发泡层,并且在两个非发泡层之间具有微发泡层。非发泡层在一个表面上的表面是光反射板,而另一表面是非发泡层或微发泡层。泡沫树脂金属涂层复合板具有在另一表面的非发泡层或微发泡层的表面上接合的铜箔或铜合金箔,以及在其表面上的铜箔或铜合金箔。发泡树脂金属涂层复合板是用于导电的布线电路。泡沫树脂金属涂层复合板具有开口部分,该开口部分的尺寸使得LED发光元件封装的壳体部分可以插入该开口部分中。 LED发光封装的壳体部分的发光面设置在板的开口部分中,并且基本上平行于板的另一非发泡层的至少一部分设置。 1(a);版权:(C)2016,JPO&INPIT

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