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HEAT SINK REMOVAL DEVICE AND HEAT SINK REMOVAL METHOD

机译:热沉去除装置和热沉去除方法

摘要

PROBLEM TO BE SOLVED: To provide a heat sink removal device which enables easy removal of a heat sink.SOLUTION: A heat sink removal device includes: a heater which heats an external heat conduction member having an adhesive force, which is reduced by heating, and configured to conduct heat between an external cooling object and an external heat sink until a temperature of the heat conduction member becomes a temperature at which the adhesive force of the heat conduction member is reduced; and a contact for energizing the heater only when the heat sink is removed.SELECTED DRAWING: Figure 1
机译:解决的问题:提供一种能够容易地移除散热器的散热器去除装置。解决方案:散热器去除装置包括:加热器,其加热具有粘合力的外部导热构件,该粘合构件通过加热而减小,构造成在外部冷却物体和外部散热器之间传导热量,直到导热构件的温度变为降低导热构件的粘合力的温度为止;以及仅在卸下散热器时才为加热器通电的触点。选定的图:图1

著录项

  • 公开/公告号JP2016152291A

    专利类型

  • 公开/公告日2016-08-22

    原文格式PDF

  • 申请/专利权人 NEC PLATFORMS LTD;

    申请/专利号JP20150028454

  • 发明设计人 SAGAWA SHOJI;

    申请日2015-02-17

  • 分类号H05K7/20;H01L23/40;

  • 国家 JP

  • 入库时间 2022-08-21 14:47:31

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