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MULTI-FUNCTION MINIATURIZED SURFACE-MOUNT DEVICE AND METHOD FOR PRODUCING THE SAME

机译:多功能微型化的表面贴装装置及其制造方法

摘要

PROBLEM TO BE SOLVED: To provide a multi-function miniaturized surface-mount device achieving multifunctionality without using a lead frame, and a method for producing such a multi-function miniaturized surface-mount device.;SOLUTION: A surface-mount device (SMD) 10 uses no lead frame and includes a multi-function die module formed from either a single die or two or more dies electrically connected in series, in parallel, or in any combination of series and parallel. The SMD also includes: a lower circuit board 50 on which the multi-function die module is mounted; an upper circuit board 60; two circuit electrodes; an encapsulant 75; and two outer electrodes 80a and 80b.;EFFECT: The SMD is formed from fewer components, is simpler to manufacture and more effectively reduces layout wire length and noise.;SELECTED DRAWING: Figure 1;COPYRIGHT: (C)2016,JPO&INPIT
机译:解决的问题:提供一种无需使用引线框架即可实现多功能的多功能小型表面安装器件,以及一种生产这种多功能小型表面安装器件的方法。 10)不使用引线框架,而是包括由单个裸片或两个或多个串联,并联或以串联和并联的任意方式电连接的裸片形成的多功能裸片模块。 SMD还包括:下部电路板50,其上安装有多功能管芯模块;以及下部电路板。上电路板60;两个电路电极;密封剂75;效果:SMD由更少的元件组成,更易于制造,并且更有效地减小了布图线的长度和噪音。选定的图纸:图1;版权:(C)2016,JPO&INPIT

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