首页> 外国专利> POLISHING DEVICE, JIG FOR MEASURING ABRASIVE PAD PROFILE, AND METHOD FOR MEASURING ABRASIVE PAD PROFILE

POLISHING DEVICE, JIG FOR MEASURING ABRASIVE PAD PROFILE, AND METHOD FOR MEASURING ABRASIVE PAD PROFILE

机译:抛光装置,用于测量研磨垫轮廓的夹具和用于测量研磨垫轮廓的方法

摘要

PROBLEM TO BE SOLVED: To measure a profile of a surface shape of an abrasive pad in a short time and with a good accuracy.SOLUTION: A first polishing device includes: a polishing table 30A to which an abrasive pad 10 for polishing a polishing object is bonded; a drive part for driving rotation of the polishing table 30A; a top ring 31A which holds the polishing object and presses the object onto the abrasive pad 10; and a line laser sensor 300 which is so disposed as to face the abrasive pad 10, irradiates a surface of the abrasive pad 10 with laser beam in a line form and measures a profile of a surface shape of the abrasive pad 10 on the basis of reflection laser beam reflected from the abrasive pad 10.
机译:解决的问题:为了在短时间内并且以良好的精度测量研磨垫的表面形状的轮廓。解决方案:第一抛光装置包括:抛光台30A,用于抛光被抛光物的研磨垫10的抛光台30A。被绑定用于驱动研磨台30A的旋转的驱动部。顶环31A保持抛光对象并将其压在研磨垫10上。布置成面对研磨垫10的线激光传感器300,以线形激光束照射研磨垫10的表面,并基于该激光来测量研磨垫10的表面形状的轮廓。从研磨垫10反射的反射激光束。

著录项

  • 公开/公告号JP2015208840A

    专利类型

  • 公开/公告日2015-11-24

    原文格式PDF

  • 申请/专利权人 EBARA CORP;

    申请/专利号JP20140093965

  • 发明设计人 ISONO YOSHINOBU;TAKAHASHI NOBUYUKI;

    申请日2014-04-30

  • 分类号B24B37/34;B24B49/12;H01L21/304;G01B11/24;G01B11/30;

  • 国家 JP

  • 入库时间 2022-08-21 14:45:48

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