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THERMAL FLOW SENSOR CHIP, METHOD FOR MANUFACTURING THERMAL FLOW SENSOR CHIP, AND FLOWMETER PROVIDED WITH THERMAL FLOW SENSOR CHIP
THERMAL FLOW SENSOR CHIP, METHOD FOR MANUFACTURING THERMAL FLOW SENSOR CHIP, AND FLOWMETER PROVIDED WITH THERMAL FLOW SENSOR CHIP
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机译:热流传感器芯片,制造热流传感器芯片的方法以及具有热流传感器芯片的流量计
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摘要
PROBLEM TO BE SOLVED: To prevent the occurrence of unevenness on a resist film and, hence, suppress a variation in sensor resistance value in a thermal flow sensor chip film deposition process, and further to improve the yield of a thermal flow sensor chip.SOLUTION: Positions of a silicon wafer (silicon substrate) 40 and a silicon wafer (silicon substrate) 52 are aligned so that a composition plane and a groove 52Gi formed on a reverse side of the silicon wafer (silicon substrate) 40 on which a circuit pattern 40SGi is formed face each other, and then a surface of the silicon wafer (silicon substrate) 52 on which the groove 52Gi is formed and a composition plane formed on the reverse side of the silicon wafer (silicon substrate) 40 are pasted together by low-temperature plasma joint.SELECTED DRAWING: Figure 1
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