THERMOPLASTIC RESIN AND RESIN COMPOSITION, AND HEAT RADIATION/HEAT TRANSFER RESIN MATERIAL AND HEAT CONDUCTION FILM COMPRISING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a thermoplastic resin or resin composition that has excellent heat conductivity and can be processed to a molding with flexibility and solder reflow resistance, and a heat radiation/heat transfer resin material and a heat conduction film comprising the same.SOLUTION: A thermoplastic resin has, as the structure of the main chain, a unit (A) having a biphenyl group of 40-60 mol%, a linear unit (B) of 30-40 mol%, a linear unit (C) of 5-15 mol%, and an aromatic unit (D) of 4-10 mol%.SELECTED DRAWING: None