POWDER HAVING HIGH THERMAL CONDUCTIVITY, HIGH ELECTRICAL INSULATION AND LOW THERMAL EXPANSION, HEAT RADIATION STRUCTURE MANUFACTURED FROM THE SAME, AND METHOD OF MANUFACTURING THE POWDER

摘要

PROBLEM TO BE SOLVED: To provide a powder from which a heat radiation structure of a semiconductor device can be manufactured at low cost, the powder having high thermal conductivity, high electrical insulation and low thermal expansion; a method of manufacturing the powder; and a heat radiation structure manufactured from the powder, such as a heat sink, a heat spreader a print circuit board, a heat radiation sheet, an encapsulation material or the like.;SOLUTION: There is provided a method for manufacturing a powder coated with AlN or Si₃ N₄11, which is generated by depositing nanoparticles of Al or Si on inorganic particles 12, while stirring them, by a physical vapor deposition method, and heat-treating them under nitrogen atmosphere, and manufacturing various heat radiation structures using the powder. In the powder coated with AlN or Si₃ N₄11, the inorganic particles 12 are Al₂O₃, Mg(OH)₂, MgO, MgCO₃, CaCO₃ and SiO₂ having an average particle diameter of 0.1 to 100 μm, and the nanoparticles 11 having an average particle diameter of 0.1 to 100 nm are deposited with a thickness of 0.1 to 100 μm on the inorganic particles 12 and then heat-treated for 3 to 6 hours at 400 to 600°C under nitrogen atmosphere.;SELECTED DRAWING: Figure 2;COPYRIGHT: (C)2016,JPO&INPIT