PERMANENT WAFER BONDING METHOD BY CONNECTION LAYER USING SOLID PHASE DIFFUSION OR PHASE TRANSFORMATION

摘要

PROBLEM TO BE SOLVED: To provide a method for bonding a first solid substrate to a second solid substrate.;SOLUTION: A method for bonding a first solid substrate 1 containing a first material to a second solid substrate 2 includes a step for forming or applying a functional layer 5, containing a second material, onto the second solid substrate 2, a step for bringing the first solid substrate and second solid substrate into contact with each other in the functional layer, and a step for pressing the first solid substrate and second solid substrate each other in order to form a permanent bond therebetween, reinforcing at least partially by solid phase diffusion and/or phase transformation of the first and second materials, and increasing the volume in the functional layer. During the period of bonding, the limit of solubility of the first material for the second material is not exceeded or exceeded only slightly, and as a result, precipitation of intermetallic phase is prevented as much as possible, and a solid-solution is formed in contrast. The first material may be copper, and the second material may be tin.;SELECTED DRAWING: Figure 1a;COPYRIGHT: (C)2016,JPO&INPIT