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(Heat sink comprising a base plate structure having a periodic pattern) heat sink, and related devices and methods, including a baseplate structure having a periodic pattern

机译:(包括具有周期性图案的基板结构的散热器)散热器以及包括具有周期性图案的基板结构的相关装置和方法

摘要

PROBLEM TO BE SOLVED: To provide a heatsink including an electromagnetic bandgap structure that reduces electromagnetic interference caused by an integrated circuit in an electronic device.;SOLUTION: A heatsink has a base 20 with an array of electrically conductive, thermally conductive patches 28 spaced in two dimensions of a reference plane and having a thickness perpendicular to the reference plane. The patches 28 are interconnected by a plurality of branches. Each branch connects adjacent patches 28 and has a width less than the width of each adjacent patch 28. A plurality of thermally conductive cooling fins 42 are coupled to a surface of the base 20 and extend normally to the reference plane. The cooling fins 42 may be formed of a thermally conductive, electrically non-conductive material or may be coupled to the base 20 by a thermally conductive, electrically non-conductive material. The periodically patterned structure of the base 20, together with a solid metal layer of a circuit board, forms an electromagnetic bandgap structure that reduces electromagnetic noise of frequencies caused by the integrated circuit.;COPYRIGHT: (C)2015,JPO&INPIT
机译:解决的问题:提供一种包括电磁带隙结构的散热片,该结构可以减少电子设备中集成电路引起的电磁干扰。解决方案:散热片的底座20上有一系列导电的导热贴片28基准平面的两个维度,并且具有垂直于基准平面的厚度。补片28通过多个分支互连。每个分支连接相邻的贴片28,并且宽度小于每个相邻的贴片28的宽度。多个导热冷却翅片42联接到基部20的表面并且垂直于参考平面延伸。散热片42可以由导热的,不导电的材料形成,或者可以通过导热的,不导电的材料耦合到基座20。基座20的周期性图案化结构与电路板的固体金属层一起形成电磁带隙结构,该结构减小了由集成电路引起的频率的电磁噪声。;版权所有:(C)2015,JPO&INPIT

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