A thermosetting resin precursor component comprising a resin system and comprising (i) one or more multifunctional epoxy resin precursors having at least three functional groups, preferably the precursor ) Is a thermosetting resin precursor component selected from a trifunctional epoxy resin precursor and / or a tetrafunctional epoxy resin precursor, and (ii) a thermoplastic polyamide particle component, wherein the polyamide particles are melted A thermoplastic polyamide particle component having a temperature TPA, and (iii) one or more curing agents, wherein the resin precursor component, the thermoplastic particles, and the curing agent (s) are resin-based curing cycles Resin system in which gelation of the epoxy matrix therein is selected to occur at a gelation temperature TGEL below TPA. [Selection figure] None
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