Polymer resin composition, a polyimide resin film, a method of manufacturing a polyimide resin film, metal laminated body and the circuit board

摘要

The present invention is related to a polymer resin composition capable of providing an insulating material having a low dielectric constant and excellent mechanical properties, a polyimide resin film obtained by using the polymer resin composition, a preparation method of a polyimide resin film, and a circuit board and a metal laminate including the polyimide resin film.