Polymer resin composition, a polyimide resin film, the manufacturing method of the polyimide resin film, metal laminated body and the circuit board

摘要

The present invention, polymer resin composition which can provide an insulating material having excellent mechanical properties and low dielectric constant, a method of manufacturing a polyimide resin film, and the polyimide resin film obtained by using this, the metal laminate comprising a polyimide resin film and to a circuit board.