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Determination method and determination program to determine the processing range and processing the order at the time of forming the hole or notch that spans more than one surface to the material

机译:确定在材料上形成一个以上表面的孔或凹口时确定加工范围和加工顺序的确定方法和确定程序

摘要

PROBLEM TO BE SOLVED: To provide a determination method which automatically determines a processing range and a processing order for processing surfaces respectively, for forming a hole or a notch across multiple surfaces in a material by using a laser processing device.SOLUTION: Development figure data is prepared by setting an outer surface corner part of a material as a development auxiliary line, and a range corresponding to board thickness of the material as a pair of board thickness lines interposing the development auxiliary line, and by setting a processing range of a hole or a notch to be formed in the material. In the step S1, the processing range is divided into a plurality of blocks by using the development auxiliary line and the board thickness lines, and when there exists a block positioned at a surface area excluding a board thickness area and if the block is combined with a block that is positioned at a neighboring board thickness area while interposing the development auxiliary line, the block is determined to be processable. In the step S2, the plurality of blocks are grouped into a plurality of processing groups, and when block height of a processing start surface is equal to or greater than a preset aperture minimum height, the block is determined to be processable.
机译:解决的问题:提供一种确定方法,该方法自动确定用于加工表面的加工范围和加工顺序,以便通过使用激光加工设备在材料中的多个表面上形成孔或凹口。通过将材料的外表面拐角部分设置为显影辅助线,并且将与该材料的板厚相对应的范围设置为介于显影辅助线之间的一对板厚线,并通过设置孔的加工范围来制备或在材料中形成一个缺口。在步骤S1中,通过使用显影辅助线和板厚线将处理范围划分为多个块,并且当存在位于除板厚区域之外的表面区域处的块时,以及是否将该块与当在插入显影辅助线的同时位于相邻板厚度区域的块被确定为可处理的。在步骤S2中,将多个块分组为多个处理组,并且当处理开始表面的块高度等于或大于预设的孔径最小高度时,确定该块为可处理的。

著录项

  • 公开/公告号JP5961100B2

    专利类型

  • 公开/公告日2016-08-02

    原文格式PDF

  • 申请/专利权人 株式会社アマダホールディングス;

    申请/专利号JP20120259522

  • 发明设计人 山崎 貴浩;

    申请日2012-11-28

  • 分类号G05B19/4097;G05B19/4093;

  • 国家 JP

  • 入库时间 2022-08-21 14:42:30

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