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Forced air-cooled heat sink

机译:强制风冷散热器

摘要

PROBLEM TO BE SOLVED: To achieve forced air-cooling of a bus bar connected to a main terminal, and the like without making dust, dirt or the like adhere to the main terminal and the like of a semiconductor module.;SOLUTION: A part of air to be made to flow into a fin 3 is made to flow into a tunnel 10 (branched flow). A tunnel opening 9b is provided on an upper face of the tunnel 10, and a not-shown plate (bus bar) 13 connected to main terminals of each of semiconductor modules 4a and 4b is provided thereon so as to block the tunnel opening 9b. Thereby, in the tunnel opening 9b, air in the branched flow is made to flow to the plate 13, and accordingly the plate 13 is forcibly cooled and efficiency of heat dissipation from the plate 13 is improved.;COPYRIGHT: (C)2014,JPO&INPIT
机译:解决的问题:在不使半导体模块的主端子等附着尘埃,尘土等的情况下,实现与主端子连接的汇流条等的强制风冷。使要流入翅片3的空气的一部分流入通道10(分支流)。隧道开口9b设置在隧道10的上表面上,并且在其上设置有连接至半导体模块4a和4b中的每个的主端子的未示出的板(汇流条)13,以阻塞隧道开口9b。从而,在隧道口9b中,使分支流中的空气流到板13,​​因此,板13被强制冷却,并且提高了从板13的散热效率。;版权所有:(C)2014,日本特许厅

著录项

  • 公开/公告号JP5962326B2

    专利类型

  • 公开/公告日2016-08-03

    原文格式PDF

  • 申请/专利权人 富士電機株式会社;

    申请/专利号JP20120179971

  • 发明设计人 辰川 昌弘;

    申请日2012-08-14

  • 分类号H01L23/467;H05K7/20;

  • 国家 JP

  • 入库时间 2022-08-21 14:42:17

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