Using metallic fabric, a method previously supplying solder to the metal surface on a substrate which is metallized, the substrate that is metallized with a solder layer having a surface structure of the fabric

摘要

present invention is a metallized been substrates (1a, 1b) the method previously supplying solder to the metal surface on the substrate (1a, 1b) preform solder metal surface (2a, 2b ) whether to mounting, or solder preforms (2a, the substrate (1a to 2b), is placed on a metal surface of 1 b), to melt the subsequently solder preform (2a, 2b), a metal surface on the substrate how about in advance for supplying the solder. Defined uniform height of the solder layer can be obtained and the formation of bulging solder does not occur, even in relatively thick solder layer of about 100 .mu.m, the solder layer has a small thickness variation than 20 m is formed to the edge, and to ensure that air bubbles form in the solder layer is minimized, when the solder supply or melt, metallic fabric (3a to the solder preform (2a, 2b), 3b ) presses the flat, the metal fabric (3a, 3b) is proposed to consist of a material having no solder wettability.