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How electronic component crimping apparatus and the electronic component bonding

机译:电子元器件压接装置与电子元器件的粘接方法

摘要

PROBLEM TO BE SOLVED: To provide an electronic component crimping apparatus and an electronic component crimping method capable of effectively and economically using a crimping sheet.;SOLUTION: A control unit 30 determines whether a crimping work which is carried out based on a next operation sequence is possible by using only crimping heads 14 the number of crimping times of which has not reached a limit value based on a piece of crimping work information. When the crimping work is determined as possible, the control unit 30 selects crimping heads 14 to be used for the crimping work from the crimping heads 14 having not reached the limit value. Contrarily, when the crimping work is determined as impossible, the control unit 30 selects the crimping heads 14 to be used in the next operation sequence from all crimping heads 14. After selecting the crimping heads 14, the control unit 30 feeds a crimping sheet 21 one pitch in a Y1 direction. After feeding of the crimping sheet 21 by one pitch, the control unit 30 resets the number of crimping times of the respective crimping heads 14.;COPYRIGHT: (C)2014,JPO&INPIT
机译:解决的问题:提供一种能够有效且经济地使用压接片的电子部件压接装置和电子部件压接方法。解决方案:控制单元30基于下一操作顺序确定是否执行压接工作。通过仅基于压接工作信息仅使用压接次数未达到极限值的压接头14,能够实现该目的。当确定压接工作时,控制单元30从尚未达到极限值的压接头14中选择要用于压接工作的压接头14。相反,当确定压接工作为不可能时,控制单元30从所有压接头14中选择要在下一操作序列中使用的压接头14。在选择压接头14之后,控制单元30进给压接片21。在Y1方向上一个螺距。在将压接片21以一间距馈送之后,控制单元30重置各个压接头14的压接次数。;版权所有:(C)2014,JPO&INPIT

著录项

  • 公开/公告号JP6019401B2

    专利类型

  • 公开/公告日2016-11-02

    原文格式PDF

  • 申请/专利号JP20130004247

  • 发明设计人 田栗 昭嘉;

    申请日2013-01-15

  • 分类号H01L21/60;H01L21/603;H05K3/32;H05K13/04;

  • 国家 JP

  • 入库时间 2022-08-21 14:42:00

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