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Formation of the insulating nitride layer by a plasma generating apparatus method and plasma generation device

机译:通过等离子体产生装置方法和等离子体产生装置形成绝缘氮化物层

摘要

PROBLEM TO BE SOLVED: To provide a plasma film deposition method capable of forming a high quality film.;SOLUTION: In a plasma state, a superimposed bias voltage is applied to a bias voltage application part 11, and in a negative voltage interval, ions collide with a workpiece 14 to form a film layer on the workpiece surface, and in a positive voltage interval 53, ions with weak adhesion force on the film layer separate from the film layer and move, and electrons collide with the film layer to peel ions of weak adhesion force and a part of the film layer, leaving a first time strong adhesion film layer by a film of strong adhesion force, and by repeating the negative voltage interval and the positive voltage interval, a multilayer film is deposited which is composed of the first time strong adhesion film layer to n-th time strong adhesion film layer.;COPYRIGHT: (C)2013,JPO&INPIT
机译:解决的问题:提供一种能够形成高质量膜的等离子膜沉积方法。解决方案:在等离子状态下,将叠加的偏置电压施加到偏置电压施加部分11上,并且以负电压间隔施加离子与工件14碰撞以在工件表面上形成膜层,并且在正电压间隔53中,在膜层上具有弱粘附力的离子与膜层分离并移动,并且电子与膜层碰撞以剥离离子附着力弱和一部分膜层的剥离,通过附着力强的膜第一次形成附着力强的膜层,通过重复负电压间隔和正电压间隔,沉积由以下组成的多层膜第一次强粘合膜层至第n次强粘合膜层。;版权所有:(C)2013,JPO&INPIT

著录项

  • 公开/公告号JP5924872B2

    专利类型

  • 公开/公告日2016-05-25

    原文格式PDF

  • 申请/专利权人 ワイエス電子工業株式会社;

    申请/专利号JP20110105901

  • 发明设计人 杉田 良雄;

    申请日2011-05-11

  • 分类号C23C14/32;H05H1/46;H01L21/31;H01L21/318;

  • 国家 JP

  • 入库时间 2022-08-21 14:41:28

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