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Optical interconnection components, optical wiring module and an optical interconnection apparatus

机译:光学互连组件,光学布线模块和光学互连设备

摘要

PROBLEM TO BE SOLVED: To improve optical transmission characteristics to/from an optical transmission path of a mounted substrate, and to reduce an optical loss in an optical through-hole in an optical wiring component.;SOLUTION: An optical wiring component 1 includes an optical wiring substrate 11, and a relay substrate 12. The relay substrate 12 includes an insulation base body 12a, and an optical through-hole 12b provided in a vertical direction in the insulation base body 12a. The optical through-hole 12b of the relay substrate 12 is optically united with an optical through-hole 11b of the optical wiring substrate 11, and united to an optical transmission path 101 of a mounting substrate 100. The optical through-hole 11b of the optical wiring substrate 11 and the optical through-hole 12b of the relay substrate 12 have different size from each other.;COPYRIGHT: (C)2014,JPO&INPIT
机译:解决的问题:改善去往/来自已安装基板的光传输路径的光传输特性,并减少光布线组件中光通孔的光损耗。解决方案:光布线组件1包括一个光学布线基板11和中继基板12。中继基板12包括绝缘基体12a和在绝缘基体12a中沿垂直方向设置的光学通孔12b。中继基板12的光学通孔12b与光学配线基板11的光学通孔11b光学地结合,并与安装基板100的光传输路径101结合。光学配线基板11和中继基板12的光学通孔12b的尺寸互不相同;版权所有(C)2014,JPO&INPIT

著录项

  • 公开/公告号JP6001327B2

    专利类型

  • 公开/公告日2016-10-05

    原文格式PDF

  • 申请/专利权人 京セラ株式会社;

    申请/专利号JP20120117674

  • 发明设计人 坂井 光治;

    申请日2012-05-23

  • 分类号G02B6/42;

  • 国家 JP

  • 入库时间 2022-08-21 14:41:19

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