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Polishing method of polishing plate and diamond material for diamond polishing material

机译:抛光板和金刚石材料的金刚石材料的抛光方法

摘要

PROBLEM TO BE SOLVED: To provide a polishing machine for polishing a diamond material, which can polish the diamond material at high speed with high surface precision.;SOLUTION: In the polishing machine for polishing a diamond material, at least a polishing surface of the polishing machine is formed of diamond particles and a binder. The diamond particles adjacent to each other are connected to each other to form a continuous structure, and the binder is formed of a diamond sintered body including at least one kind of element selected from a group of Ni, Co and Fe, at least one kind of element selected from a group of Ti, Zr, Hf, V, Nb, Ta, Cr, Mo and W, and a carbide of at least one kind of element selected from the group of Ti, Zr, Hf, V, Nb, Ta, Cr, Mo and W.;COPYRIGHT: (C)2013,JPO&INPIT
机译:要解决的问题:提供一种用于抛光金刚石材料的抛光机,该抛光机可以高速,高精度地抛光金刚石材料。;解决方案:在用于抛光金刚石材料的抛光机中,至少要对金刚石材料的抛光表面进行抛光。抛光机由金刚石颗粒和粘合剂组成。彼此相邻的金刚石颗粒彼此连接以形成连续结构,并且粘合剂由金刚石烧结体形成,该金刚石烧结体包括选自Ni,Co和Fe的组中的至少一种元素,至少一种元素。选自Ti,Zr,Hf,V,Nb,Ta,Cr,Mo和W的元素的元素,以及选自Ti,Zr,Hf,V,Nb的元素中的至少一种元素的碳化物, Ta,Cr,Mo和W .;版权所有:(C)2013,日本特许厅和INPIT

著录项

  • 公开/公告号JP5870562B2

    专利类型

  • 公开/公告日2016-03-01

    原文格式PDF

  • 申请/专利权人 住友電気工業株式会社;

    申请/专利号JP20110194079

  • 发明设计人 山本 佳津子;角谷 均;

    申请日2011-09-06

  • 分类号B24B9/16;B24B1/00;B24B37/12;

  • 国家 JP

  • 入库时间 2022-08-21 14:41:07

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