Positive photosensitive resin composition, method for forming polyimide resin pattern, and patterned polyimide resin film

摘要

Provided is a positive photosensitive resin composition containing a polyimide resin that allows patterns to be satisfactorily formed by means of photolithography, and provides patterns with excellent heat resistance. Further provided is a method for forming polyimide resin patterns using the positive photosensitive resin composition. Further provided is a patterned polyimide resin film formed by means of the method for forming polyimide resin patterns. To the photosensitive resin composition are added, an (A) polyimide resin, and a (B) compound in which an imidazole compound having a specific structure is generated by the action of light.