Manufacturing method of a CMOS compatible micro-channel heat sink for the electronic cooling

摘要

This invention is the CMOS compatibility polymer micro channel heat sink for thermoelectric cooling. The heat sink is direct production possible on the tip/chip surface which possesses insulating layer making use of standard polymer surface microprocessing technology. The heat sink device, has with the metal layer of the thin film as an insulated thin layer and the bottom surface which is on the tip/chip surface and the side wall of the metal make and the polymer upper wall which covers micro channel and the flow entrance and exit container.