Chip division spacing device, and chip division spaced method

摘要

PROBLEM TO BE SOLVED: To provide an apparatus and method for chip division and separation, in which dicing tape is expanded evenly depending on anisotropy thereof when the dicing tape is expanded to separate each chip, in a case with the dicing tape having anisotropic expansion.;SOLUTION: The chip division and separation apparatus comprises: a frame 4 for supporting a circumference of a dicing film 3 by a frame supporting means 5 in cylindrical shape; and a film surface supporting mechanism 6a (X1, X2, Y1, Y2) included inside the frame supporting means 5 for independently controlling tension applied for the dicing film 3 corresponding to an X direction and a Y direction of a chip 2a to be separated from a wafer 2. Then, the frame supporting means 5 relatively moves downward against the film surface supporting mechanism 6a so as to expand the dicing film 3, and each chip 2a can be divided and separated with even intervals.;COPYRIGHT: (C)2013,JPO&INPIT