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Lead-free solder water-soluble flux removal for cleaning agents, removal method and cleaning method

机译:用于清洁剂的无铅焊料水溶性助焊剂的去除,去除方法和清洁方法

摘要

It can clean the water soluble flux residue which it occurs the occasion soldered the lead free solder with the water soluble flux at brief, furthermore that the detergent for lead free solder water soluble flux removal which possesses dissolved and the narrow gap cleaning Characteristic which are superior is offered as purpose it designates. This invention glycol ether compound (A) 5 - 100 weight sections is the detergent for lead free solder water soluble flux removal which is included vis-a-vis the water 100 weight section.
机译:可以简单地清洗水溶性助焊剂焊接无铅焊料时出现的水溶性助焊剂残留物,而且具有溶解性的无铅焊料水溶性助焊剂去除剂和窄间隙清洗性能优越。提供它指定的目的。本发明的乙二醇醚化合物(A)为5-100重量份,是用于除去无铅焊料的水溶性助焊剂的洗涤剂,相对于水100重量份而言。

著录项

  • 公开/公告号JP5857740B2

    专利类型

  • 公开/公告日2016-02-10

    原文格式PDF

  • 申请/专利权人 荒川化学工業株式会社;

    申请/专利号JP20110529867

  • 发明设计人 田中 俊;田中 啓太;守能 祥信;

    申请日2010-08-20

  • 分类号C11D7/26;C11D7/16;C11D7/32;C11D7/50;C23G5/032;C23G5/036;B08B3/08;

  • 国家 JP

  • 入库时间 2022-08-21 14:39:41

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