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Finish polishing process of the glass substrate, and alkali-free glass substrate which is finish polishing in the process

机译:玻璃基板的精加工工序以及在该工序中进行精加工的无碱玻璃基板

摘要

The present invention uses a polishing slurry containing cerium oxide as abrasive grains, polishing the main surface of the glass substrate, a final polishing method of a glass substrate, the composition of the glass substrate, the following non an alkali glass, the amount of polishing of the glass substrate when the height of the swell in terms of swell of 20mm pitch of the main surface of the glass substrate is changed from 0.14 m to 0.10 m when the X ( m) , including the step of polishing under the conditions 0.04 / X is 0.12 or more, of the glass substrate on the finish polishing method: be a strain point of 710 or more, the average thermal expansion coefficient of at 50~350 30 10 -7 ~43 10 -7 a / , the temperature T glass viscosity of 10 2 dPa s 2 is not more 1710 or less, glass viscosity of 10 4 dPa s to become temperature T 4 is not more 1320 or less , as represented by mol% based on oxides, SiO 2 : 66~70, Al 2 O 3 : 12~15, B 2 O 3 : 0~1.5, MgO: 9.5 ultra 13 or less, CaO: 4~9, SrO: 0.5~4.5, BaO: 0 ~1, ZrO 2 : 0~2 containing MgO + CaO + SrO + BaO is 17 to 21, and the MgO / (MgO + CaO + SrO + BaO) is 0.40 or more, MgO / (MgO + CaO) is 0.40 or more at is, MgO / (MgO + SrO) is an alkali-free glass, which is a 0.60 or more.
机译:本发明使用包含氧化铈作为磨粒的抛光浆,抛光玻璃基板的主表面,玻璃基板的最终抛光方法,玻璃基板的组成,以下非碱玻璃,抛光量当X(m)时,包括以0.04 / m的条件进行抛光的步骤时,当将玻璃基板的主表面的20mm间距的膨胀的高度的膨胀高度从0.14m改变为0.10m时,玻璃基板的厚度从0.14m变为0.10m。精加工法中的玻璃基板的X为0.12以上:应变点为710以上,平均热膨胀系数为50〜350 30 10 -7 〜43 10 < Sup> -7 a /,温度T玻璃粘度10 2 dPa s 2 不大于1710,玻璃粘度10 4 dPa s变为温度T 4 不超过1320或更少,以基于ox的mol%表示SiOs 2 :66〜70,Al 2 O 3 :12〜15,B 2 O < Sub> 3 :0〜1.5,MgO:9.5 ultra 13以下,CaO:4〜9,SrO:0.5〜4.5,BaO:0〜1,ZrO 2 :0〜含有MgO + CaO + SrO + BaO的2为17〜21,MgO /(MgO + CaO + SrO + BaO)为0.40以上,MgO /(MgO + CaO)为0.40以上,MgO /(MgO + SrO)是0.60以上的无碱玻璃。

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