首页> 外国专利> W-BAND COMBINER-SPLITTER FABRICATED USING 3-D PRINTING

W-BAND COMBINER-SPLITTER FABRICATED USING 3-D PRINTING

机译:使用3D打印制造W波段组合分离器

摘要

Methods and systems are disclosed for scalable antenna arrays that may be built up using pluggable tiles that have low distortion, flat band high gain, and structured to channelize the signals into narrow bands that may be 40 MHz or even smaller bandwidth apart. Antenna array tiles may employ traveling wave tube (TWT) components and wafer scale arrays. H-topology, equal length, feed networks connect the signals to antenna elements. The fractal-like, recursively repeating at different size scales, structure for the H-tree feed networks, implemented using pluggable tiles, facilitates the scalability of the high gain waveguide antenna array. System integration across the 75-115 GHz spectral band implements scalable aperture architecture with emphasis on addressing considerations of the TX power requirement, feed network, channelizing signals at different frequency bands using specially designed diplexers and combiners, cooling, component placement, and isolation.
机译:公开了用于可伸缩天线阵列的方法和系统,该可伸缩天线阵列可以使用具有低失真,平坦带高增益的可插拔瓦片来构建,并且被构造为将信号信道化为可以相隔40MHz或什至更小的带宽的窄带。天线阵列砖可以采用行波管(TWT)组件和晶圆级阵列。长度相等的H拓扑馈电网络将信号连接到天线元件。使用可插拔的瓦片实现的,以不同的尺寸尺度递归地重复的类似分形的H树馈电网络结构,有助于高增益波导天线阵列的可扩展性。在75-115 GHz频谱范围内的系统集成实现了可扩展的孔径架构,重点解决了TX功率要求,馈电网络,使用专门设计的双工器和组合器在不同频带上信道化信号,冷却,组件放置和隔离的注意事项。

著录项

  • 公开/公告号US2016301430A1

    专利类型

  • 公开/公告日2016-10-13

    原文格式PDF

  • 申请/专利权人 FARROKH MOHAMADI;

    申请/专利号US201615180595

  • 发明设计人 FARROKH MOHAMADI;

    申请日2016-06-13

  • 分类号H04B1;H04L5/08;B33Y80;C25D3/48;B29C67;C23C18/16;C25D7;H01Q21/06;B33Y10;

  • 国家 US

  • 入库时间 2022-08-21 14:39:17

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号