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COATING FORMING DEVICE AND COATING FORMING METHOD FOR FORMING METAL COATING

机译:用于形成金属涂层的涂层形成装置和涂层形成方法

摘要

A coating forming device for forming a metal coating on a surface of a substrate includes: an anode; a power supply; and a solid electrolyte membrane disposed between the anode and the substrate and contains metal ions. The solid electrolyte membrane includes: a contact surface that is a region contacting a coating-forming region where the metal coating is formed; and a concave portion recessed relative to the contact surface such that, when the contact surface contacts the coating-forming region, the solid electrolyte membrane is not in contact with a portion of the surface of the substrate excluding the coating-forming region. The metal ions are reduced to form the metal coating on the coating-forming region by the power supply applying a voltage between the anode and the substrate.
机译:一种用于在基板的表面上形成金属涂层的涂层形成装置,包括:阳极;阳极;和阳极。电源;固体电解质膜设置在阳极与基板之间并包含金属离子。固体电解质膜包括:接触表面,该接触表面是与形成金属涂层的涂层形成区域接触的区域;以及接触表面。相对于接触面凹陷的凹部,使得当接触面接触涂层形成区域时,固体电解质膜不与基板的除了涂层形成区域以外的部分接触。通过在阳极和基板之间施加电压的电源,金属离子被还原以在涂层形成区域上形成金属涂层。

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