Various planar inverted-F antenna configurations may include an antenna element formed on the top of a PCB and a ground element formed on the bottom of the PCB. Two or more slots may be included in the antenna element for reducing the antenna area while maintaining a suitable impedance bandwidth. A slot may be included in the ground element for reducing the ground area while increasing radiation efficiency. A folded ground may be formed on the top of the PCB for reducing system area while maintaining suitable performance. By moving the folded ground closer to the antenna element and increasing the PCB thickness, significant reductions in system area may be achieved, while maintaining or improving performance in terms of radiation pattern, radiation efficiency and impedance bandwidth.
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