首页> 外国专利> METHOD FOR FILLING A JOINT WITH AN ADHESIVE AND/OR SEALING MATERIAL AND SYSTEM FOR FILLING A JOINT WITH AN ADHESIVE AND/OR SEALING MATERIAL

METHOD FOR FILLING A JOINT WITH AN ADHESIVE AND/OR SEALING MATERIAL AND SYSTEM FOR FILLING A JOINT WITH AN ADHESIVE AND/OR SEALING MATERIAL

机译:用胶粘剂和/或密封材料填充接头的方法以及用胶粘剂和/或密封材料填充接头的系统

摘要

The present disclosure relates to a method for filling a joint with an adhesive and/or sealing material. The method can include: a) positioning a first part, such as an insert, and a second part, such as a frame, so that the first and second parts form the joint; b) introducing a movable spacer into the joint; c) positioning a nozzle element over the joint; d) displacing the nozzle element along the joint such that the nozzle element strikes against the spacer and moves the latter forwards; and e) discharging the adhesive and/or sealing material out of an exit nozzle of the nozzle element during step d).
机译:本发明涉及一种用粘合剂和/或密封材料填充接头的方法。该方法可以包括:a)定位第一部分,例如插入物,和第二部分,例如框架,使得第一部分和第二部分形成接头; b)将可移动的垫片插入接头; c)将喷嘴元件定位在接头上; d)沿接头移动喷嘴元件,使喷嘴元件撞击垫片并使垫片向前移动; e)在步骤d)中将粘合剂和/或密封材料从喷嘴元件的出口喷嘴排出。

著录项

  • 公开/公告号US2016176104A1

    专利类型

  • 公开/公告日2016-06-23

    原文格式PDF

  • 申请/专利权人 SIKA TECHNOLOGY AG;

    申请/专利号US201414910127

  • 发明设计人 MANUEL BUCK;

    申请日2014-08-14

  • 分类号B29C65/54;B29C65/70;B29C65;

  • 国家 US

  • 入库时间 2022-08-21 14:36:47

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