SCHEDULING APPLICATIONS IN PROCESSING DEVICES BASED ON PREDICTED THERMAL IMPACT

摘要

A processing device includes a plurality of components and a system management unit to selectively schedule an application phase to one of the plurality of components based on one or more comparisons of predictions of a plurality of thermal impacts of executing the application phase on each of the plurality of components. The predictions may be generated based on a thermal history associated with the application phase, thermal sensitivities of the plurality of components, or a layout of the plurality of components in the processing device.