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Light emitting member having a wiring board with through hole exposing a light emitting semiconductor element with a light reflecting member covering a peripheral wall portion of the through hole
Light emitting member having a wiring board with through hole exposing a light emitting semiconductor element with a light reflecting member covering a peripheral wall portion of the through hole
A light emitting device includes a heat dissipation board, a wiring board that is bonded and fixed to the heat dissipation board and formed with a through-hole, a semiconductor light emitting element that is mounted on a face of the heat dissipation board, the face being exposed through the through-hole of the wiring board, and a light reflecting member that covers a portion of an inner peripheral wall surface of the through-hole of the wiring board, the portion being squarely opposed to a side surface of the semiconductor light emitting element.
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