首页> 外国专利> White curable resin composition for printed wiring board on which light emitting element is mounted, cured product thereof, printed wiring board having the cured product, and reflecting plate for light emitting element comprising the cured product

White curable resin composition for printed wiring board on which light emitting element is mounted, cured product thereof, printed wiring board having the cured product, and reflecting plate for light emitting element comprising the cured product

机译:搭载有发光元件的印刷线路板用白色固化性树脂组合物,其固化物,具有该固化物的印刷线路板以及包含该固化物的发光元件用反射板

摘要

A white hardening resin composition includes a hardening resin and rutile-type titanium oxide produced by a chlorine method.
机译:白色硬化树脂组合物包括硬化树脂和通过氯法生产的金红石型氧化钛。

著录项

  • 公开/公告号JP6134672B2

    专利类型

  • 公开/公告日2017-05-24

    原文格式PDF

  • 申请/专利权人 太陽ホールディングス株式会社;

    申请/专利号JP20140046897

  • 发明设计人 大胡 義和;宇敷 滋;

    申请日2014-03-10

  • 分类号C08L101;C08K3/22;H05K3/28;

  • 国家 JP

  • 入库时间 2022-08-21 13:55:42

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