首页> 外国专利> Power Semiconductor Module System Having a High Isolation Strength and Method for Producing a Power Semiconductor Module Arrangement Having a High Isolation Strength

Power Semiconductor Module System Having a High Isolation Strength and Method for Producing a Power Semiconductor Module Arrangement Having a High Isolation Strength

机译:具有高隔离强度的功率半导体模块系统和用于制造具有高隔离强度的功率半导体模块装置的方法

摘要

A power semiconductor module includes a module housing having a top side, a first terminal group, and a second terminal group. A circuit board, which has a first electrode and a second electrode, is mountable on the power semiconductor module in such a way that in the mounted state each terminal of the first group is electrically conductively connected to the first electrode and each terminal of the second group is electrically conductively connected to the second electrode. A first isolation web and/or a second isolation web is provided. Each isolation web is fixed to the circuit board even in the unmounted state, and arranged between the first terminal group and the second terminal group in the mounted state.
机译:功率半导体模块包括具有顶侧的模块壳体,第一端子组和第二端子组。具有第一电极和第二电极的电路板可安装在功率半导体模块上,使得在安装状态下,第一组的每个端子与第一电极和第二组的每个端子导电连接。基团导电地连接到第二电极。提供了第一隔离网和/或第二隔离网。每个隔离网即使在未安装状态下也固定到电路板上,并且在安装状态下布置在第一端子组和第二端子组之间。

著录项

  • 公开/公告号US2016029478A1

    专利类型

  • 公开/公告日2016-01-28

    原文格式PDF

  • 申请/专利权人 INFINEON TECHNOLOGIES AG;

    申请/专利号US201514809714

  • 发明设计人 REINHOLD BAYERER;

    申请日2015-07-27

  • 分类号H05K1/02;H05K3/30;H05K5/00;H05K1/18;

  • 国家 US

  • 入库时间 2022-08-21 14:33:31

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号