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Integrated connector modules for extending transformer bandwidth with mixed-mode coupling using a substrate inductive device
Integrated connector modules for extending transformer bandwidth with mixed-mode coupling using a substrate inductive device
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机译:集成连接器模块,可通过使用衬底感应设备的混合模式耦合来扩展变压器带宽
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摘要
An improved low cost and highly consistent inductive apparatus. In one embodiment, the low cost and highly consistent inductive apparatus addresses concerns with so called conductive anodic filament (CAF) that occurs within these laminate structures. These conditions include high humidity, high bias voltage (i.e. a large voltage differential), high-moisture content, surface and resin ionic impurities, glass to resin bond weakness and exposure to high assembly temperatures that can occur, for example, during lead free solder bonding application. In a variant, mixed mode coupling techniques are utilized in order to extend the underlying operating bandwidth of the substrate inductive device. Methods of manufacturing and using the aforementioned substrate inductive devices are also disclosed.
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