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Portable apparatus, IC packaging structure, IC packaging object, and IC packaging method thereof
Portable apparatus, IC packaging structure, IC packaging object, and IC packaging method thereof
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机译:便携式设备,集成电路封装结构,集成电路封装对象及其集成电路封装方法
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摘要
A portable apparatus, an IC packaging structure, an IC packaging object, and an IC packaging method thereof are disclosed. The IC packaging structure includes an IC packaging object and a substrate. The packaging object includes a die and a metallurgy layer. The die has a contact portion, a saw reserved portion, and a seal ring. The seal ring is disposed between the contact portion and the saw reserved portion. The metallurgy layer is disposed on the contact portion. At least a part of the metallurgy layer overlaps the seal ring. The metallurgy layer includes a solderable layer coated by a solder paste. The substrate includes a solder pad. The solder pad is coupled to the solderable layer coated by the solder paste.
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