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Substrate support with radio frequency (RF) return path

机译:具有射频(RF)返回路径的基板支持

摘要

Apparatus for processing substrates are provided herein. In some embodiments, an apparatus for processing a substrate includes a substrate support that may include a dielectric member having a surface to support a substrate thereon; one or more first conductive members disposed below the dielectric member and having a dielectric member facing surface adjacent to the dielectric member; and a second conductive member disposed about and contacting the one or more first conductive members such that RF energy provided to the substrate by an RF source returns to the RF source by traveling radially outward from the substrate support along the dielectric member facing surface of the one or more first conductive members and along a first surface of the second conductive member disposed substantially parallel to a peripheral edge surface of the one or more first conductive members after travelling along the dielectric layer facing surface.
机译:本文提供了用于处理基板的设备。在一些实施例中,一种用于处理衬底的设备包括衬底支撑件,该衬底支撑件可以包括介电构件,该介电构件具有在其上支撑衬底的表面;一个或多个第一导电构件,其设置在所述介电构件的下方并且具有与所述介电构件相邻的面对介电构件的表面;以及第二导电构件,该第二导电构件围绕一个或多个第一导电构件并与其接触,以使得由RF源提供给基板的RF能量通过从基板支撑件沿其一个面向电介质构件的表面径向向外行进而返回到RF源。在沿着介电层面对表面行进之后,沿着第二导电构件的第一表面基本上平行于一个或多个第一导电构件的外围边缘表面布置。

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