producing a single-staged or multistaged cavity,shaping the removable integrated chip-module card(s) in a mini-SIM, micro-SIM, nano-SIM and/or embedded-SIM format with notched or through-notched features and/or webs between each removable integrated chip-module card(s) and the carrier card, andadhesive bonding of an integrated chip module into the cavity."/> Method for Producing a Paper Carrier Card with Removable Integrated Chip Module Card, and Paper Carrier Card Made of Paper with Removable Integrated Chip Module Card
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Method for Producing a Paper Carrier Card with Removable Integrated Chip Module Card, and Paper Carrier Card Made of Paper with Removable Integrated Chip Module Card

机译:具有可移动集成芯片模块卡的纸质卡的制造方法以及具有可移动集成芯片模块卡的纸质纸质卡

摘要

A method for producing a carrier card with a removable integrated chip-module card(s), where the carrier card is in an ID-1 format and is made of a single-layer or multilayer paper, and where the individual layers have predetermined material properties, and are joined by a waterproof adhesive. The method includesproducing a single-staged or multistaged cavity,shaping the removable integrated chip-module card(s) in a mini-SIM, micro-SIM, nano-SIM and/or embedded-SIM format with notched or through-notched features and/or webs between each removable integrated chip-module card(s) and the carrier card, andadhesive bonding of an integrated chip module into the cavity.
机译:一种用于制造具有可移动集成芯片模块卡的载体卡的方法,其中,所述载体卡为ID-1格式,并且由单层或多层纸制成,并且各个层具有预定的材料。性能,并通过防水胶粘剂连接在一起。该方法包括 产生单级或多级腔体, 将mini-SIM,micro-SIM,nano-SIM和/或Embedded-SIM格式的可移动集成芯片模块卡成形为带有缺口或贯穿缺口的特征和/或网状结构可移除的集成芯片模块卡和载体卡,以及 将集成芯片模块粘接到空腔中。 < / UnorderedList>

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