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Temporary liquid thermal interface material for surface tension adhesion and thermal control
Temporary liquid thermal interface material for surface tension adhesion and thermal control
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机译:用于表面张力粘附和热控制的临时液体热界面材料
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摘要
An assembly including a liquid thermal interface material for surface tension adhesion and thermal control used during electrical/thermal test of a 3D wafer and methods of use. The method includes temporarily attaching a thinned wafer to a carrier wafer by applying a non-adhesive material therebetween and pressing the thinned wafer and the blank silicon-based carrier wafer together.
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