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Cu-Ni-Si-based copper alloy plate having excellent deep drawing workability and method of manufacturing the same
Cu-Ni-Si-based copper alloy plate having excellent deep drawing workability and method of manufacturing the same
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机译:具有优异的深冲加工性的Cu-Ni-Si基铜合金板及其制造方法
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摘要
The Cu—Ni—Si-based copper alloy plate contains 1.0 mass % to 3.0 mass % of Ni, and Si at a concentration of ⅙ to ¼ of the mass % concentration of Ni with a remainder of Cu and inevitable impurities, in which, when the average value of the aspect ratio (the minor axis of crystal grains/the major axis of crystal grains) of each crystal grains in an alloy structure is 0.4 to 0.6, the average value of GOS in the all crystal grains is 1.2° to 1.5°, and the ratio (Lσ/L) of the total special grain boundary length Lσ of special grain boundaries to the total grain boundary length L of crystal grain boundaries is 60% to 70%, the spring bending elastic limit becomes 450 N/mm2 to 600 N/mm2, the solder resistance to heat separation is favorable and deep drawing workability is excellent at 150° C. for 1000 hours.
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机译:Cu-Ni-Si基铜合金板包含1.0质量%至3.0质量%的Ni和Si,其浓度为Ni的质量%浓度的1/3至1/4,并且具有剩余的Cu和不可避免的杂质,其中,当合金结构中的每个晶粒的纵横比的平均值(晶粒的短轴/晶粒的长轴)的平均值为0.4至0.6时,所有晶粒中的GOS的平均值为1.2° 1.5°,并且特殊晶界的特殊晶界总长度Lσ与结晶晶界的总晶界长度L之比(Lσ/ L)为60%至70%,弹簧弯曲弹性极限为450N / mm 2 Sup>至600 N / mm 2 Sup>,耐热分离性良好,在150℃下1000小时的深冲加工性优异。
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