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Tape feeder and tape feeding method for chip mounter

机译:带式送料器和芯片安装机的带式送料方法

摘要

A tape feeder for a chip mounter, the tape feeder including: a tape support unit extending along a moving direction of a carrier tape to which a cover tape is separably attached, and contacting a top surface of the carrier tape; a separation unit separating a first side portion of the cover tape in a lengthwise direction; a bending guide unit guiding the first side portion of the cover tape separated from the carrier tape such that the first side portion of the cover tape separated from the carrier tape is bent and away from the separated portion of the carrier tape; and a folding guide unit folding the first side portion over a second side portion of the cover tape to drop the first side portion downward.
机译:一种用于芯片安装机的带式供料器,该带式供料器包括:沿支撑带的移动方向延伸的带支撑单元,盖带可分离地附接到该支撑带单元,并与载带的顶表面接触;分离单元,其在长度方向上将覆盖带的第一侧部分离。弯曲引导单元,用于引导与载带分离的盖带的第一侧部,以使与载带分离的盖带的第一侧部弯曲并远离载带的分离部。折叠引导单元将第一侧部折叠在盖带的第二侧部上以使第一侧部向下下落。

著录项

  • 公开/公告号US9414536B2

    专利类型

  • 公开/公告日2016-08-09

    原文格式PDF

  • 申请/专利权人 HANWHA TECHWIN CO. LTD.;

    申请/专利号US201314427682

  • 发明设计人 KIMIYUKI YAMASAKI;

    申请日2013-04-03

  • 分类号H05K13/02;B65H35;B65H37;B65D85/671;H05K13/04;B65D73/02;

  • 国家 US

  • 入库时间 2022-08-21 14:28:16

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