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Method for making three dimensional memory array architecture using phase change and ovonic switching materials

机译:利用相变和电子交换材料制作三维存储阵列架构的方法

摘要

Three dimension memory arrays and methods of forming the same are provided. An example three dimension memory array can include a stack comprising a plurality of first conductive lines separated from one another by at least an insulation material, and at least one conductive extension arranged to extend substantially perpendicular to the plurality of first conductive lines, such that the at least one conductive extension intersects a portion of at least one of the plurality of first conductive lines. Storage element material is formed around the at least one conductive extension. Cell select material is formed around the at least one conductive extension.
机译:提供了三维存储器阵列及其形成方法。示例性三维存储器阵列可以包括堆叠,该堆叠包括被至少一个绝缘材料彼此隔开的多条第一导电线,以及被布置为基本上垂直于多条第一导电线延伸的至少一个导电延伸部,使得至少一个导电延伸部与多条第一导线中的至少一个的一部分相交。在至少一个导电延伸部周围形成存储元件材料。围绕至少一个导电延伸部形成单元选择材料。

著录项

  • 公开/公告号US9252362B2

    专利类型

  • 公开/公告日2016-02-02

    原文格式PDF

  • 申请/专利权人 MICRON TECHNOLOGY INC.;

    申请/专利号US201414470247

  • 发明设计人 FEDERICO PIO;

    申请日2014-08-27

  • 分类号H01L45/00;H01L27/10;H01L27/24;H01L27/06;

  • 国家 US

  • 入库时间 2022-08-21 14:28:15

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