Method to provide the thinnest and variable substrate thickness for reliable plastic and flexible electronic device

摘要

An electronic device is formed by depositing polyimide on a glass substrate. A conductive material is deposited on the polyimide and patterned to form electrodes and signal traces. Remaining portions of the electronic device are formed on the polyimide. A second polyimide layer is then formed on the first polyimide layer. The glass substrate is then removed, exposing the electrodes and the top surface of the electronic device.