首页> 外国专利> ELECTROPOLISHING OF COPPER AND STAINLESS STELL IN LOW TEMPERATURE MOLTEN SALT ELECTROLYTE

ELECTROPOLISHING OF COPPER AND STAINLESS STELL IN LOW TEMPERATURE MOLTEN SALT ELECTROLYTE

机译:低温熔融盐电解质中铜和不锈钢的电解抛光

摘要

The present invention provides a new improved method for electro polishing of copper and stainless steel from low temperature molten salt electrolyte pertaining imidazolium type of ions. Experiments were carried out separately for copper electro polishing as well as stainless steel at normal atmospheric pressure without hazardous chemicals used in normal electro polishing. Before electro polishing copper and stainless steel specimens were pretreated. For electro polishing of copper with imidazole ethylene glycol was added to lower the crystallisation temperature whereas for electro polishing of stainless steel methyl iodide and suphamic acid was added with ethylene glycol and the polishing was carried out in 5-10 minutes. The molar concentrations of used chemicals , temperature, current density were optimised depending upon the quality of electro polishing. The quality of electro polishing has been obtained as in normal electro polishing i.e; normal aqueous electrolytes. Temperature, current density and the molar ranges of chemicals used for electro polishing in molten salt electrolyte were optimised after conducting the experiments in trial and runs. We could achieve bright electro polishing in novel simple route at normal atmospheric pressure(90mm Hg) without any sophisticated facilities as already claimed prior in so many patents and literature.
机译:本发明提供了一种新的改进方法,用于从属于咪唑鎓型离子的低温熔融盐电解质中电抛光铜和不锈钢。在正常大气压下分别进行了铜电抛光和不锈钢的实验,而普通电抛光中没有使用有害化学物质。在电抛光之前,对铜和不锈钢样品进行预处理。为了用咪唑进行铜的电抛光,加入乙二醇以降低结晶温度,而为了进行不锈钢的电抛光,用碘代甲烷和苏打酸加入乙二醇,并在5-10分钟内进行抛光。取决于化学抛光的质量,可以优化所用化学药品的摩尔浓度,温度,电流密度。与常规电抛光相同,即已获得电抛光的质量。普通的水性电解质。在进行试验和运行后,对用于熔融盐电解质中电抛光的温度,电流密度和化学物质的摩尔范围进行了优化。我们可以在新颖的简单方法下于常压(90mm Hg)上实现明亮的电抛光,而无需像许多专利和文献先前所要求的那样具有任何先进的设备。

著录项

  • 公开/公告号IN2014DE00091A

    专利类型

  • 公开/公告日2016-05-06

    原文格式PDF

  • 申请/专利权人

    申请/专利号IN91/DEL/2014

  • 申请日2014-01-13

  • 分类号

  • 国家 IN

  • 入库时间 2022-08-21 14:25:26

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