SLIT MACHINING DEVICE AND SLIT MACHINING METHOD

摘要

This slit machining device (100) machines a slit in an optical film (F1) while performing undulation control using a first detection device (106). The first detection device (106) includes: a first support body (111) that supports the first surface of an optical film (F1); a first light source unit (112a) that illuminates light from the second surface side of the optical film (F1) towards the optical film (F1) positioned on a first reflective surface (RS); a first polarizing plate (112c) provided on the optical path of light from the first light source unit (112a) towards the optical film (F1); a first imaging unit (112b) that images the reflected light image of the optical film (F1) positioned on the first reflective surface (RS1) from the second surface side of the optical film (F1); and a first pattern detection unit (114) that detects a plurality of polarized pattern sequences (F14a, F14b) positioned on the first reflective surface (RS) on the basis of the reflected light image of the optical film (F1) imaged by the first imaging unit (112b).