HIGH-CTI HALOGEN-FREE EPOXY RESIN COMPOSITION FOR COPPER-CLAD PLATE AND USES THEREOF

摘要

Disclosed are a high-CTI halogen-free epoxy resin composition for a copper-clad plate and uses thereof. The high-CTI halogen-free epoxy resin composition consists of the following components in parts by weight: 100 to 140 parts of halogen-free phosphorus epoxy resin, 10 to 35 parts of dicyclopentadiene phenolic epoxy resin, 32 to 60 parts of benzoxazine, 1 to 5 parts of phenolic resin, 0.05 to 0.5 part of accelerant and 25 to 70 parts of filler. The copper-clad base plate prepared according to the present invention can meet requirements of high CTI (CTI≥500 V), high heat resistance (Tg≥150ºC, PCT,2h6 min) and flame resistance of UL-94V0-level, and is widely used in electronic materials for motors and electric appliances, white household appliances and the like.