THERMOSETTING RESIN COMPOSITION FOR DEGRADABLE HEAT-CONDUCTING ALUMINUM-BASED COPPER-CLAD PLATE, HEAT-CONDUCTING ALUMINUM-BASED COPPER-CLAD PLATE, AND PREPARATION METHOD AND RECOVERY METHOD THEREOF

摘要

The present invention relates to the field of copper-clad plates. Disclosed are a thermosetting resin composition for a degradable heat-conducting aluminum-based copper-clad plate, heat-conducting aluminum-based copper-clad plate, and preparation method and recovery method thereof, the preparation method comprising: uniformly dispersing an epoxy resin, a degradable curing agent, a heat-conducting filler and other additives to prepare a uniformly dispersed dispersion liquid; coating the dispersion liquid on a copper foil, and baking the copper foil to obtain copper foil coated with resin; and laminating an aluminum plate and the copper foil coated with resin, and conducting high-temperature laminating to obtain a heat-conducting aluminum-based copper-clad plate. The method of the present invention prepares a heat-conducting aluminum-based copper-clad plate capable of being completely degraded and having excellent overall performances such as a high heat conducting coefficient, high peeling strength and high breakdown voltage, thus realizing efficient and environmentally friendly recovery of aluminum plates, heat-conducting filler and resin.